Welcome to Capzer Pharmaceuticals
Driven by our understanding for the need of quality contract work, we are poised to transform our technology know-how into reality. Since its inception, Capzer has been undertaking multi-faceted services to become a unique leader in the contract pharmaceuticals arena.
Our Integrity
Our professional staff consist of scientists and engineers with proven record of deliverables. With diversified experience, Capzer can accomplish any challenges into a solution. To meet and exceed their expectations, every step is quality checked for perfection and budgetary considerations. Our dedication to satisfy customer needs is our number one priority.
Registration
Our lab is FDA & DEA registered.
Services
Along with our dedicated and qualified staff, we use highly sensitive instruments to develop and validate any challenging method. Our Agilent 1260 HPLC with Infinity Diode Array Detector brings up to 10 times higher sensitivity with detection speed to HPLC. Our instruments are capable of heating as well as cooling the column. Similarly, sample compartments can be cooled as well as heating up to 80°C. This flexibility of cooling and heating option of both sample & column can give a great tool for degradation study as well as kinetic study of the compound, without time consuming experiments in the lab. Capzer lab is designed to address your research needs.
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- Assay & impurities (development & validation)
- Dissolution (automated & capable of high-thru-put testing sample using UV-Vis spectrophotometer)
- Residual Solvents (development & validation; USP <467>)
- Analysis of Active Pharmaceutical Ingredients (API), Raw materials, Finished Products (development & validation)
- Development of trace analytical method to detect organic compound or DNA adducts in Biological samples, using high resolution GC-TOF-MS.
- Small scale synthesis of small and large molecules
- Total Organic Carbon (TOC)
- USP/NF Monograph method
Capzer has the capability of testing samples (chemical & biological) with high resolution GC-TOF-MS &MALDI-TOF/TOF-MS.
LC/MS: Thermo Finnigan LCQ Deca XP Plus (with Agilent 1100 HPLC w/DAD) – full-scan LC/MS/MS and provides information for molecular weight information, structural information (multi-stage structural mass analysis). Due to its high sensitivity, the analytical problems for structural elucidation and identification of unknown impurities in complex, pharmaceutical or other matrices are easily achievable.
Our state-of-the-art microbiology lab is equipped with the latest equipments necessary to perform micro testing. Our comprehensive abilities include API, excipients, finished products and nutritional products. Among our specialization is isolating, detecting, testing and identifying the organisms.
Water Testing
Capzer scientists have a broad range of technical expertise for testing antibiotics using microbiological assay USP <81>
Water Testing
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- Detection of Coliform
- Total Aerobic Microbial Count
- Total Coliform
- Fecal Coliform
- Escherichia coli
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- Food beverages
- Dairy products
- Cosmetics
Capzer scientists have a broad range of technical expertise for testing antibiotics using microbiological assay USP <81>
Our extensive OTC experience can overcome any challenging assignment. Having state-of-the-art equipment with the highest sensitivity, we can achieve very reliable data within a short period of time.
Because of the complex nature of the products, testing OTC requires special attention during method development. Our scientists have the expertise to develop and validate those products.
Today’s FDA requirements for submission are more stringent than ever and require a great deal of consistency and compliance with documentation. Our experts can guide compiling, examining and assisting with the submission process. Subsequently, in case of deficiency, we can help provide consultation on deficiency response.
Our Lab has the capability to analyze food products for compliance with legal and labeling requirements, assessment of product quality, determination of nutritive value, detection of adulteration, and research and development.
Field Emission Scanning Electron Microscopy(FE-SEM)
Scanning electron imaging to view samples at magnifications up to 500,000 times.
Metrology, construction analysis, defect analysis
Hitachi S4800, FEI XL50
Energy Dispersive X-Ray Spectroscopy (EDS)
Elemental analysis
Defect analysis, construction analysis
NORAN System SIX
Back Scattered Electron Imaging (BSE)
Contrast imaging of wafer cross section. Provides composition information
Process identification
Hitachi S4800
Focused Ion Beam (FIB)
Sample preparation technique using ion beam to mill into very specific area of interest.
Defect analysis, construction analysis, TEM sample prep
FEI XL830, XL835 Dual Beam systems
Dualbeam-STEM (FIB)
Sample preparation technique using ion beam to mill into very specific area of interest. In-situ imaging using Scanning Transmission Electron Microscopy.
Defect analysis, construction analysis, TEM sample prep, Circuit edit
FEI Strata 400S
Transmission Electron Microscopy (TEM)
Imaging of electrons transmitted through <100 nm thick speciman.
Construction analysis, crystal phase, lattice damage and grain orientation
JEM-ARM200F
JEOL 2010
Philips (FEI) CM300
Analytical Transmission Electron Microscopy (AEM)
Elemental analysis on TEM sample.
Defect analysis, construction analysis
Gatan GIF-2002 Electron Energy Loss Spectrometer and Noran System Six EDXS
Scanning electron imaging to view samples at magnifications up to 500,000 times.
Metrology, construction analysis, defect analysis
Hitachi S4800, FEI XL50
Energy Dispersive X-Ray Spectroscopy (EDS)
Elemental analysis
Defect analysis, construction analysis
NORAN System SIX
Back Scattered Electron Imaging (BSE)
Contrast imaging of wafer cross section. Provides composition information
Process identification
Hitachi S4800
Focused Ion Beam (FIB)
Sample preparation technique using ion beam to mill into very specific area of interest.
Defect analysis, construction analysis, TEM sample prep
FEI XL830, XL835 Dual Beam systems
Dualbeam-STEM (FIB)
Sample preparation technique using ion beam to mill into very specific area of interest. In-situ imaging using Scanning Transmission Electron Microscopy.
Defect analysis, construction analysis, TEM sample prep, Circuit edit
FEI Strata 400S
Transmission Electron Microscopy (TEM)
Imaging of electrons transmitted through <100 nm thick speciman.
Construction analysis, crystal phase, lattice damage and grain orientation
JEM-ARM200F
JEOL 2010
Philips (FEI) CM300
Analytical Transmission Electron Microscopy (AEM)
Elemental analysis on TEM sample.
Defect analysis, construction analysis
Gatan GIF-2002 Electron Energy Loss Spectrometer and Noran System Six EDXS
Neutron Activation Analysis(NAA)
Neutron Activation Analysis
Identify and measure trace contaminants in bulk materials
Inorganic materials such as polysilicon. Organic polymers tissues and biological materials.
ppt to ppb
High Resolution Inductively Coupled Plasma Mass Spectroscopy (HR-ICPMS)
High Resolution Inductively Coupled Plasma Mass Spectrometer
Identify and measure trace metals in aqueous samples
VPD samples, ultra pure water, process chemicals, material extracts, chemical waste streams
ppt to ppb
Vapor Phase Decomposition (VPD)
Vapor Phase Decomposition
Collection process used to identify and measure trace metals on wafer surfaces.
Silicon wafers, hydrofluoric acid soluble thin films
E6 to E14 atoms/cm2
GeMeTec WSPS with PAD-Fume and PAD-Scan
Gemetec Wafer Surface Preparation System with Programmable Automated Decomposition Fumer and Programmable Automated Droplet Scanner
Automated VPD prep tool. Wafers are handled by robot in ULPA filtered class 10 environment and transferred from cassette stand to fuming module to scanning module.
Silicon wafers, hydrofluoric acid soluble thin films
E6 to E14 atoms/cm2
Inductively Coupled Plasma Optical Emission Spectroscopy (ICPOES)
Inductively Coupled Plasma Optical Emission Spectrometer
identify and measure trace metals in aqueous samples
water, chemicals, material extracts, slurries, chemical waste streams
ppb to ppm
Wavelength Dispersive X-Ray Fluorescence Spectroscopy (WDXRF)
Wavelength Dispersive X-Ray Fluorescence Spectrometer
qualitative and quantitative elemental analysis of solid materials
Identify unknowns, elemental bulk analysis, thin films composition, contaminant studies
ppm to wt%
Fourier Transform Infrared Spectroscopy (FTIR)
Micro Fourier Transform Infrared Spectrometer
identification of organic and inorganic compounds
Identify molecular composition of organic materials and polymers, characterize thin films, analyze non-reactive gases
wt%
Thermal Desorb Gas Chromatograph Mass Spectroscopy (ATD-GC-MS)
Thermal Desorb Gas Chromatograph Mass Spectrometer
qualitative and quantitative analysis of organic compounds and mixtures
solvents, air samples, process chemicals, water, polymers, wafers
ppb to wt%
Ion Chromatography (IC)
Ion Chromatography
Aqueous ionics measurements
anions and cations in UPW, diluted chemicals, material extracts
ppb to ppm
Total Organic Carbon (TOC)
Total Organic Carbon Analyzer
inorganic and organic carbon determinations in aqueous samples
water, water extracts
0.1 to 10ppm
Auto-Titrator
Potentiometry based autotitration systems
Neutron Activation Analysis
Identify and measure trace contaminants in bulk materials
Inorganic materials such as polysilicon. Organic polymers tissues and biological materials.
ppt to ppb
High Resolution Inductively Coupled Plasma Mass Spectroscopy (HR-ICPMS)
High Resolution Inductively Coupled Plasma Mass Spectrometer
Identify and measure trace metals in aqueous samples
VPD samples, ultra pure water, process chemicals, material extracts, chemical waste streams
ppt to ppb
Vapor Phase Decomposition (VPD)
Vapor Phase Decomposition
Collection process used to identify and measure trace metals on wafer surfaces.
Silicon wafers, hydrofluoric acid soluble thin films
E6 to E14 atoms/cm2
GeMeTec WSPS with PAD-Fume and PAD-Scan
Gemetec Wafer Surface Preparation System with Programmable Automated Decomposition Fumer and Programmable Automated Droplet Scanner
Automated VPD prep tool. Wafers are handled by robot in ULPA filtered class 10 environment and transferred from cassette stand to fuming module to scanning module.
Silicon wafers, hydrofluoric acid soluble thin films
E6 to E14 atoms/cm2
Inductively Coupled Plasma Optical Emission Spectroscopy (ICPOES)
Inductively Coupled Plasma Optical Emission Spectrometer
identify and measure trace metals in aqueous samples
water, chemicals, material extracts, slurries, chemical waste streams
ppb to ppm
Wavelength Dispersive X-Ray Fluorescence Spectroscopy (WDXRF)
Wavelength Dispersive X-Ray Fluorescence Spectrometer
qualitative and quantitative elemental analysis of solid materials
Identify unknowns, elemental bulk analysis, thin films composition, contaminant studies
ppm to wt%
Fourier Transform Infrared Spectroscopy (FTIR)
Micro Fourier Transform Infrared Spectrometer
identification of organic and inorganic compounds
Identify molecular composition of organic materials and polymers, characterize thin films, analyze non-reactive gases
wt%
Thermal Desorb Gas Chromatograph Mass Spectroscopy (ATD-GC-MS)
Thermal Desorb Gas Chromatograph Mass Spectrometer
qualitative and quantitative analysis of organic compounds and mixtures
solvents, air samples, process chemicals, water, polymers, wafers
ppb to wt%
Ion Chromatography (IC)
Ion Chromatography
Aqueous ionics measurements
anions and cations in UPW, diluted chemicals, material extracts
ppb to ppm
Total Organic Carbon (TOC)
Total Organic Carbon Analyzer
inorganic and organic carbon determinations in aqueous samples
water, water extracts
0.1 to 10ppm
Auto-Titrator
Potentiometry based autotitration systems
Surface Science Techniques
Secondary Ion Mass Spectroscopy(SIMS)
Mass analysis surface and depth profiling
Dopant or compositional element depth analysis
Secondary Ions
Down to 1e12 at/cm3
Quadrupole Secondary Ion Mass Spectroscopy(Quad SIMS)
Thin Film and Shallow Implant Depth Profile
Dopant or compositional element depth profile
Secondary Ions
Down to 1E16 at/cm3
Auger Electron Spectroscopy(AES)
Elemental surface analysis
Depth profiling with Ar sputter, surface contamination, cross-section analysis
Auger electrons
0.1-1 at%
Electron Spectroscopy for Chemical Analysis
(aka ESCA or XPS)
Elemental Surface analysis
Depth profiling with Ar sputter, chemical state information, thin film composition analysis
Photoelectrons
0.1 at%
X-Ray Diffraction
(XRD)
Crystal Orientation Analysis
Grain size, orientation, and texture analysis
Crytal plane d-spacing
+/-.5%
X-Ray Reflection
(XRR)
Reflectivity Analysis
Density, Interfacial Roughness, and Thickness of thin films
Reflected X-rays
+/- 3% of signals detected
Atomic Force Microscopy
(AFM)
Surface topography
Roughness of thin films, and step height information
Atomic morphology
< 2 Å
Rutherford Backscattering spectrometry (RBS)
Elemental surface analysis
Thin film stoichiometry and composition and impurity analysis of films and materials
Backscattered ions
1 E 14/ cm2
Dependent on mass of target atom.
Ion Channeling
Elemental analysis and depth profiling for single crystals
Lattice location of defects and impurities in single crystal materials
Backscattered ions
1 E 14/cm2
Dependent on mass of target atom.
Micro-Raman Spectroscopy(µ-RS)
Molecular composition
Defect analysis, thin film monitoring
Bond vibration frequencies
Sample dependent
Total Reflection X-Ray Fluorescence Spectroscopy(TXRF)
Elemental composition
Trace contamination on wafer surfaces
Secondary x-ray fluorescence
1 E 9/cm2
Mass analysis surface and depth profiling
Dopant or compositional element depth analysis
Secondary Ions
Down to 1e12 at/cm3
Quadrupole Secondary Ion Mass Spectroscopy(Quad SIMS)
Thin Film and Shallow Implant Depth Profile
Dopant or compositional element depth profile
Secondary Ions
Down to 1E16 at/cm3
Auger Electron Spectroscopy(AES)
Elemental surface analysis
Depth profiling with Ar sputter, surface contamination, cross-section analysis
Auger electrons
0.1-1 at%
Electron Spectroscopy for Chemical Analysis
(aka ESCA or XPS)
Elemental Surface analysis
Depth profiling with Ar sputter, chemical state information, thin film composition analysis
Photoelectrons
0.1 at%
X-Ray Diffraction
(XRD)
Crystal Orientation Analysis
Grain size, orientation, and texture analysis
Crytal plane d-spacing
+/-.5%
X-Ray Reflection
(XRR)
Reflectivity Analysis
Density, Interfacial Roughness, and Thickness of thin films
Reflected X-rays
+/- 3% of signals detected
Atomic Force Microscopy
(AFM)
Surface topography
Roughness of thin films, and step height information
Atomic morphology
< 2 Å
Rutherford Backscattering spectrometry (RBS)
Elemental surface analysis
Thin film stoichiometry and composition and impurity analysis of films and materials
Backscattered ions
1 E 14/ cm2
Dependent on mass of target atom.
Ion Channeling
Elemental analysis and depth profiling for single crystals
Lattice location of defects and impurities in single crystal materials
Backscattered ions
1 E 14/cm2
Dependent on mass of target atom.
Micro-Raman Spectroscopy(µ-RS)
Molecular composition
Defect analysis, thin film monitoring
Bond vibration frequencies
Sample dependent
Total Reflection X-Ray Fluorescence Spectroscopy(TXRF)
Elemental composition
Trace contamination on wafer surfaces
Secondary x-ray fluorescence
1 E 9/cm2
A partial list of Nutraceuticals Products:
Vitamin A
Vitamin E
Vitamin D3 (as Cholecalciferol)
Thiamin
Riboflavin
Niacin
Calcium
Vitamin B1 (Thiamine Mononitrate)
Vitamin B2 (as Riboflavin)
Vitamin B3 (as Niacinamide)
Vitamin B5 (as Calcium Pantothenate)
Vitamin B6 (as Pyridoxine HCl)
Vitamin C (as Ascorbic Acid)
Folic Acid
Vitamin B12 (as Cyanocobalamin)
Calcium
Iron (as Ferrous Fumarate)
Zinc (as Zinc Oxide)
Vitamin A
Vitamin E
Vitamin D3 (as Cholecalciferol)
Thiamin
Riboflavin
Niacin
Calcium
Vitamin B1 (Thiamine Mononitrate)
Vitamin B2 (as Riboflavin)
Vitamin B3 (as Niacinamide)
Vitamin B5 (as Calcium Pantothenate)
Vitamin B6 (as Pyridoxine HCl)
Vitamin C (as Ascorbic Acid)
Folic Acid
Vitamin B12 (as Cyanocobalamin)
Calcium
Iron (as Ferrous Fumarate)
Zinc (as Zinc Oxide)
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